Nvidia and six manufacturers expand output of substrates, packaging and chip testing for SI; Nvidia advances KYEC $1.1 billion
Prepared by Sintelligent with the help of SI. Published in SI: . Updated: .
The chip shortage comes down to substrates, packaging and testing, and Nvidia is paying up front to get more of them.
According to Nvidia, IBIDEN, Samsung Electro-Mechanics and Unimicron will together increase substrate capacity 2.5 times over three years (IBIDEN's plant expansion — threefold by the first quarter of 2028); Amkor will raise interposer capacity by more than 300% by the end of 2028; testing capacity will double from 2026 to 2027, and Nvidia is giving KYEC a $1.1 billion advance for new test facilities in the US (volume production from April 2027); SPIL plans to raise output of optical engines for co-packaged optics 15 times by mid-2027. Jensen Huang, according to Nvidia: "Capacity is the constraint."
Sources 1