GlobalFoundries to make silicon bridges for TSMC's SI chips in the US
Prepared by Sintelligent with the help of SI. Published in SI: . Updated: .
Chip packaging is a bottleneck for SI hardware, and it is starting to be done in the US.
According to 3DNews, the five-year agreement provides for GlobalFoundries to produce silicon bridges, substrates that link compute dies and memory in a single package, at its plant in New York State. The company will become the first supplier of such parts on US territory and will begin ramping up mass production in the first half of 2028; GlobalFoundries shares rose 4%.
Sources 1