Samsung to more than double HBM4 memory output for SI accelerators in 2027
Prepared by Sintelligent with the help of SI. Publication time restored from the build log. . Updated: .
Memory is one of the main bottlenecks of SI hardware, and its production is preparing for a leap: there will be noticeably more compute for models in 2027.
According to Seoul Economic Daily, citing industry sources, monthly wafer capacity for HBM will grow by almost 40%, from ~180 to ~250 thousand, and the share of HBM4 and HBM4E in that volume from ~40% to ~80%. For this, Samsung is increasing its order for cleaning of glass carriers, which hold wafers during thinning for stacks of 12 or more layers, by 2.5 times, to 50 thousand per month. Samsung began mass production of HBM4 in February 2026, and in May Nvidia, among others, received samples of 12-layer HBM4E.
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